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Vapour-Phase Soldering System
For Laboratories, Prototyping and
Close-to-Production Process Qualifications
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Vapor-phase soldering system for the high volume inline production.
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Flexible and universally applicable reflow soldering system.
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During Vapor Phase Heating (VPH), parts are directly immersed in a heated vapor blanket. The saturated vapor condenses and transfers its latent heat of vaporization to the surface of the parts. VPH, also called condensation heating, is therefore a very versatile method of heat transfer.
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The ASSCON-desoldering system for the use in vapor-phase soldering machines. Multi-leaded SMD-components, ballgrid-arrays, connectors as well as mechanical components may be desoldered correctly and safely.
New Technology - Multi-Vacuum
Milestones in Vacuum Soldering Technology
Back in 1999, ASSCON’s invention of the worldwide first vapour phase vacuum soldering process has already set a milestone for in- dustrial electronic production. The vacuum soldering process proved to be a successful solution for constantly challenging soldering tasks while process windows were getting continuously smaller.
The rising number of vapour phase vacuum soldering systems in the electronic industry validates the essential impact of this vacuum sol- dering process. However the soldering tasks of the future will require a more advanced vacuum technology.
Multivacuum – The Soldering Process of the Future
The essential quality features required for these future applications are provided by the multivacuum soldering process. In this process, assemblies are subjected to several vacuum applications with the option of applying vacuum both before and during the melting of the solder paste.
Applying vacuum processes before the liquidus temperature is reached is particularly useful for removing any voids encapsulated and caused by printing or pick & place processes - for example while scooping out the soldering paste during the printing process - even before the soldering paste is molten. This way the voiding potential is eliminated before the heating process is even started.
The main causes for gaseous voids remaining in the solder joint dur- ing later production processes are therefore traced back to the out- gassing of components, printed circuit boards and basic materials, as well as reactive gas released in the removal of oxide layers through the fluxing agent.
The multivacuum process helps to effectively remove these voids from the still liquid solder joint by allowing assemblies to be subjected to several independently controllable vacuum processes in a short-term sequence. Multiple successive evacuations shift voids encapsulated in the solder joint in a manner ensuring that they reach its periphery, where they can be removed very effectively. Especially with large soldered joints, this enables the elimination of a significantly greater number of voids than would be the case with a single vacuum opera- tion alone.
The multivacuum process in particular also enables void-free solder joints where products with an above average outgassing potential are concerned (e.g. high number of layers in multilayer, large processors). Gases entering to the solder joint in a first vacuum stage can addition- ally also be effectively removed from the still liquid solder joint in sub- sequent vacuum stages.
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