The CSP (Chip Scale Package) is a technology for lowering the manufacturing cost of LED and is an important item in the LED industry. As the packaging process becomes increasingly complicated and difficult, inspection becomes increasingly difficult. However, defects can be detected by inspecting the electrode parts of CSP Solder for LED using X-ray. The quality of the electrode part Void, the state of the solder-ball between the electrodes, and the bonding separation can be checked, minimizing the quality error.